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The Challenge:   Decreasing Wafer Fabrication Costs, while Managing Increasingly Complex Chip Designs.

The wafer production fabs of the 21st century demand metrology tools that are cost effective, versatile, consistently accurate and modular in design.nbsp; Only such tools can help decrease exploding wafer fabrication costs while increasing yield through early defect detection and advanced process control.nbsp; Because of intrinsic limitations associated with X-ray, Eddy Current, 4 point probe, ellipsometry, reflectometry, and other metrology methods, there is a need for new technology that can address the challenges associated with increasingly sophisticated chip designs aggressively advancing into deep sub-100-nm feature sizes.nbsp; This technology must also minimize tool complexity, increase throughput and reduce overall metrology cost of ownership (COO).

The Solution:   Impedance Resonance Technology (IRT) - innovative real-time contactless method offering multi-functional measurement capability.  IRT provides real-time non-destructive measurement of single thin film or stack of thin films (when measurements conducted consecutively).  Measurements can be applied to all types of thin films: dielectrics, semiconductors, thin metals, and organics.  IRT based tools could be used to determine thin film thickness and uniformity of patterned or blank films.  It could also be used to determine film’s bulk resistivity, "sheet_p", dielectric constant of insulators and other physical characteristics of thin films.

Standard IST Sensor Specifications
Measurement spot size 0.25mm² - 40mm²
Measurement range (resistance - Ohm/sq) 0.001-250
Accuracy (resistance) < 1%
Repeatability (resistance) < 0.05%
Range of film thickness 1nm - 6,000nm
Types of measurable film Cu, Al, W, Mo, Au, Co, Ni, Ru, Ti, TiN, Co, Cr
Relative dielectric constant 1 - 500
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